CRG09 2013-11-01 1 toshiba rectifier silicon diffused type CRG09 general purpose rectifier applications ? repetitive peak reverse voltage: v rrm = 400 v ? average forward current: i f (av) = 1.0 a ? forward voltage: v fm = 1.1 v (max) (@i fm = 0.7 a) ? high esd capability ? suitable for high-density board a ssembly due to the use of a small surface-mount package, s ? flat tm absolute maximum ratings (ta = 25c) characteristics symbol rating unit repetitive peak reverse voltage v rrm 400 v average forward current i f(av) 1.0 (note 1) a non-repetitive peak surge current i fsm 15 (50 hz) a junction temperature t j ? 40 to 150 c storage temperature t stg ? 40 to 150 c note: using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause th is product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/v oltage, etc.) are within the absolute maximum ratings. please design the appropriate reliability upon reviewing the toshiba semiconductor reliability handbook (?handling precautions?/?derating conc ept and methods?) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). note 1: ta = 66c device mounted on a ceramic board board size: 50 mm 50 mm soldering size: 2 mm 2 mm board thickness: 0.64 mm unit: mm anode cathode 0.16 0 ~ 0.1 0.65 0.2 0.65 0.2 3.5 0.2 2.6 0.1 0.98 0.1 0.9 0.1 + 0.2 ? 0.1 1.6 jedec D jeita D toshiba 3-2a1a weight: 0.013 g (typ.) start of commercial production 2008-12
CRG09 2013-11-01 2 electrical character istics (ta = 25c) characteristics symbol test condition min typ. max unit v fm (1) i fm = 0.1 a (pulse test) ? 0.83 ? v fm (2) i fm = 0.7 a (pulse test) ? 0.95 1.1 peak forward voltage v fm (3) i fm = 1.0 a (pulse test) ? 1.00 ? v repetitive peak reverse current i rrm v rrm = 400 v (pulse test) ? ? 10 a esd(1) c = 150 pf , r = 2 k ? , a contact electric discharge ? 25 ? kv electrostatic discharge capability esd(2) c = 330 pf , r = 2 k ? , a contact electric discharge ? 25 ? kv device mounted on a ceramic board (board size: 50 mm 50 mm) (soldering land: 2 mm 2 mm) (board thickness: 0.64 mm) ? ? 65 thermal resistance (junction to ambient) r th (j-a) device mounted on a glass-epoxy board (board size: 50 mm 50 mm) (soldering land: 6 mm 6 mm) (board thickness: 1.6 mm) ? ? 130 c/w thermal resistance (junction to lead) r th (j- ? ) ? ? ? 20 c/w marking abbreviation code part no. g9 CRG09 land pattern dimensions for reference only 2.8 1.2 1.2 unit: mm part no.(or abbreviation code) cathode mark and lot code anode cathode g9
CRG09 2013-11-01 3 handling precaution 1) the absolute maximum ratings denote the absolute maximu m ratings, which are rated values that must not be exceeded during operation, even for an instant. the following ar e the general derating methods that we recommend for designing a circuit incorporating this device. v rrm : we recommend that the worst case voltage, includi ng surge voltage, be no greater than 80% of the absolute maximum rating of v rrm for a dc circuit and be no great er than 50% of that of v rrm for an ac circuit. v rrm has a temperature coefficient of 0.1%/c. take this temperature coefficient into account designing a device at low temperature. i f(av) : we recommend that the worst case current be no greater than 80% of the absolute maximum rating of i f(av) . carry out adequate heat design. if you can?t design a circuit with excellent heat radiation, set the margin by using an allowable ta max-i f (av) curve. i fsm : this rating specifies the non-repetitive peak current. th is is only applied for an abnormal operation, which seldom occurs during the lifes pan of the device. t j : derate this rating when using a device in order to ensure high reliability. we recommend that a device be used at a t j of below 120c. 2) thermal resistance between junction and ambient fluc tuates depending on the device?s mounting condition. when using a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value. 3) please refer to the rectifiers databook for further information.
CRG09 2013-11-01 4 ta m a x ? i f (av) device mounted on a glass-epoxy board board size:50mm x 50mm, soldering land:6mm x 6mm instantaneous forward voltage v f (v) i f ? v f instantaneous forward current i f (a) average forward current i f (av) (a) p f (av) ? i f (av) average forward power dissipation p f (av) (w) average forward current i f (av) (a) ta m a x ? i f (av) device mounted on a ceramic board board size:50mm x 50mm, soldering land:2mm x 2mm maximum allowable temperature ta m a x ( c ) average forward current i f (av) (a) maximum allowable temperature ta m a x ( c ) 0.4 0.8 0.01 0.1 1 10 1.2 2.0 1.6 1.8 75c t j = 25c pulse test 0 0.4 0.8 0 0.2 0.8 1.2 0.6 1.6 1.2 0.4 160 0 0 40 0.4 1.2 20 60 120 100 0.2 0.6 80 0.8 1.0 0 0 0.4 0.6 1.0 1.2 0.2 0.8 conduction angle 180 0 180 half sine waveform 1.0 140 2.2 conduction angle 180 0 180 half sine waveform number of cycles surge forward current (non-repetitive) peak surge forward current i fsm (a) 1 100 10 0 10 20 30 25 5 15 ta = 25c f = 50 hz conduction angle 180 0 180 half sine waveform -40c 150c 1.4 1.0 0.6 0.2 160 40 20 60 120 100 80 140 t ? max ? i f (av) average forward current i f (av) (a) maximum allowable lead temperature t ? max (c) 0 0 0.4 0.6 1.0 1.2 0.2 0.8 conduction angle 180 0 180 half sine waveform 160 40 20 60 120 100 80 140 1.4 1.0 0.6
CRG09 2013-11-01 5 time t (s) r th (j-a) ? t transient thermal impedance r th (j-a) (c/w) (2) (1) 1 10 1000 10000 0.001 0.01 0.1 100 1 10 100 (1) device mounted on a ceramic board: board size: 50 mm 50 mm soldering land: 2 mm 2 mm board thickness: 0.64 mm (2) device mounted on a glass-epoxy board: board size: 50 mm 50 mm soldering land: 6 mm 6 mm board thickness: 1.6 mm
CRG09 2013-11-01 6 restrictions on product use ? toshiba corporation, and its subsidiaries and affiliates (collect ively "toshiba"), reserve the right to make changes to the in formation in this document, and related hardware, software and systems (collectively "product") without notice. ? this document and any information herein may not be reproduc ed without prior written permission from toshiba. even with toshiba's written permission, reproduc tion is permissible only if reproduction is without alteration/omission. ? though toshiba works continually to improve product's quality and reliability, product can malfunction or fail. customers are responsible for complying with safety standards and for prov iding adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a ma lfunction or failure of product could cause loss of human life, b odily injury or damage to property, including data loss or corruption. before customers use the product, create designs including the product, or incorporate the product into their own applications, cu stomers must also refer to and comply with (a) the latest versions of all relevant toshiba information, including without limitation, this document, the specifications, the data sheets and application notes for product and the precautions and condi tions set forth in the "toshiba semiconductor reliability handbook" and (b) the instructions for the application with which the product will be us ed with or for. customers are solely responsible for all aspe cts of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this product in such design or applications; (b) eval uating and determining the applicability of any info rmation contained in this document, or in c harts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operatin g parameters for such designs and applications. toshiba assumes no liability for customers' product design or applications. ? product is neither intended nor warranted fo r use in equipments or systems that require extraordinarily high levels of quality and/or reliability, and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage and/or serious public impact ( " unintended use " ). except for specific appl ications as expressly stated in this document, unintended use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used f or automobiles, trains, ships and other transportation, traffic si gnaling equipment, equipment used to control combustions or expl osions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. if you use product for unintended use, toshiba assumes no liability for product. for details, please contact your toshiba sales representative. ? do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy product, whether in whole or in part. ? product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. ? the information contained herein is pres ented only as guidance for product use. no re sponsibility is assumed by toshiba for an y infringement of patents or any other intellectual property rights of third parties that may result from the use of product. no license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. ? absent a written signed agreement, except as provid ed in the relevant terms and conditions of sale for product, and to the maximum extent allowable by law, toshiba (1) assumes no liability wh atsoever, including without limitation, indirect, co nsequential, special, or incidental damages or loss, including without limitation, loss of profit s, loss of opportunities, business interruption and loss of data, and (2) disclaims any and all express or implied warranties and conditions related to sale, use of product, or information, including warranties or conditions of merchantability, fitness for a particular purpose, accuracy of information, or noninfringement. ? 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